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Process Capabilities (Lead & RoHS
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Surface Mount Technology (with BGA's)
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Mixed Technology
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Through-Hole Technology
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Rigid, Rigid Flex, and Flex Circuit assembly
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Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced)
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Conformal Coat
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Systems Integration and Box Build Assembly
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Soldering Standard: J-Standard, IPC-A-610 Rev D and NASA 8739 .2 & .3
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Strict adherence to industry standards of ESD control
Environmental Test Chamber
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