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Silicon Forest Electronics, Inc. - Your Partner in Electronics Contract Manufacturing Services
Silicon Forest Electronics, Inc. - Your Partner in Electronics Contract Manufacturing Services
 

4040

SFE 4040 Flying Probe

The SPEA is a "second generation" Flying Probe tester offering improved mechanical and electrical accuracy in comparison to other flying probers. We use the electro scan" feature to detect open solder joints on IC's including BGA's and we use the optical inspection to find reversed polarized components.

Using the Cameras for Accurate alignment and Optical Inspection

Using precision cameras, the probe points are placed with repeatable accuracy within 4 mils (80 microns). This second generation FPT is five times more accurate than competing machines. The 4040's camera performs an automated optical inspection (AOI) function of parts that are not tested electrically. The FPT provides test coverage beyond the traditional in-circuit test without the expense of the bed-of-nails fixture. The development costs are usually less than one fifth the cost of bed-of-nails testing and the test coverage is based on available CAD data. We program to check the assembly against the BOM and not a learned response.

  • No fixture means lower cost for test development
  • Your Flying probes test will be ready before first articles are built
  • No test points, not a problem the SPEA 4040 contacts SMT components
  • The test is created from the BOM and CAD data for higher and accurate coverage
  • Shorts testing checks for solder process integrity
  • Full test of resisters, capacitors, diodes, transistors, and other passives
  • Electro-scan checks for unsoldered device pins
  • Ideal for Prototype boards that are likely to be re-designed in the future
  • Production runs of small size or infrequent production runs

SFE's Flying Probe Tester capabilities

The following capabilities will be immediately available with our new FPT from SPEA. The 4040 Hi-Line optimizes the production flow with a wide range of additional functions:

  • Fast program generation starting from Cad files or assisted manually
  • In Circuit Test
  • Process Test
  • Parametric Test
  • Automatic Optical Inspection (AOI)
  • Shuttle or In-Line boards loading
  • In-Circuit instruments
  • Functional instruments
  • Open Pin Scan

The following capabilities can be purchased in the future but will not be immediately available with our system:

  • On Board Programming
  • Boundary Scan Test
  • Nodal-Z impedance test (NZT)
  • Functional test
  • V/I Programmable power supplies

SPEA 4040 Flying Probe tester recommendations

The SPEA 4040 Flying Probe has the accuracy and capability to test PC boards that have not been built using DFT rules. Any of the following can be overcome, but if these rules are applied, the quality and speed of testing is greatly improved.

DFT Recommendations:

  • Vias and test pads should be unmasked on both sides of the board to allow access away from component leads.
  • Total access to every net on one side of the board. This eliminates the need to test the board from both sides, which increases handling and test times.
  • If the only access to a net is at a component, the pad for the component pin should be extended to allow the flying probe to hit the pad and not the component. 200um x 200um hitting area is recommended.
  • Fiducial marks are very important for alignment. Fiducials should be located in an area free of components and at diagonal corners of the board.
  • Component height can be a problem with flying probers. No fly zones can be defined, but that will increase test time. It is recommended to keep the overall component height less than 30000 um. If the exceeded height is required, it is recommended to group all tall components in one area of the board and make sure access to nets are away for that area.
  • To allow the PCB to be transported on automatic handling systems and safe attachment during test, it is recommended that at least 5mm of free space from the edge of the board to components is maintained.

SPECIFICATIONS OF THE MACHINE<
The following specification limits apply to the boards that can be run through this machine:
Test area: 685x610 mm (27x24")
XY axes acceleration up to 4g
Minimum contactable pad: 80um (0.003")

CAD files supported by SPEA

CAD SYSTEM REQUIRED FILES
Academi .ALL    
ARIADNE .PCA    
CadPack- import part list from ASCII file ASCII    
Becker Automotive file format .ASC    
CADENCE .FAB    
Cadif Updated .PAF    
C-Link .DIF    
Fabmaster .CAD    
Fatf .FAT    
GenCad .IGE .GCD .CAD
Gerber .GBR** .GDO** .GER**
Landis & Staefa file format .STK    
Mentor .CMP    
NOKIA file format .PLT    
Orcad .PAR .NEC  
CadPack- Import Orcad layout .MIN    
Pads .ASC    
Pcad .PDF    
PROTEL .CSV .HYP .PIK
Redac Cadstar .CDI    
Theda .TL    
TXF-OUT .TXF    
Veribest BOM    
ZUKEN CR3000 .CCF .UDF .WDF
TOPCAD .PD1 DBF NET
ZUKEN CR5000 .PCF    
Export to Test Program ASCII data ASCII    

** ONLY ONE FROM THIS LIST IS REQUIRED

 

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