Production Capabilities and Test & Design Services
Machine Assembly
- Surface Mount Technology, including BGA and micro-BGA placements
- Dedicated “Quick Turn” Manufacturing Lines
- Convection and Vapor Phase Reflow
- 0201 Placement Capability
- Selective Soldering
Hand Assembly
- Through-Hole Technology
- Wave Solder
- Press-fit Assembly
- Box Build Assembly
Inspection and Process Control
- 3D solder paste inspection
- AOI (Automated Optical Inspection)
- X-Ray
Specialty Processes
- Conformal Coating
- Flex and Rigid-Flex Assembly
- ROHS (Lead-Free) and Lead Capabilities
Test System Development
- Analog signals from precision DC to millimeter-wave.
- Digital signals from simple signal routing applications to complex, high-speed system controllers.
Test Methods
- Flying-Probe
- Custom In-Circuit Test (ICT)
- Functional Test
- Boundary-Scan
Design Support Services
- Design-for-Manufacturability Review
- Design-for-Test Review
- Printed Circuit Board Layout Services
